A Time-Domain Method for the Analysis of Thermal Impedance Response Preserving the Convolution Form

dc.contributor.authorCarmona, Manuel
dc.contributor.authorMarco, Santiago
dc.contributor.authorPalacín Roca, Jordi
dc.contributor.authorSamitier, Josep
dc.date.accessioned2016-07-12T08:50:42Z
dc.date.embargoEndDate2025-01-01
dc.date.issued1999
dc.description.abstractThe study of the thermal behavior of complex packages as multichip modules (MCM’s) is usually carried out by measuring the so-called thermal impedance response, that is: the transient temperature after a power step. From the analysis of this signal, the thermal frequency response can be estimated, and consequently, compact thermal models may be extracted. We present a method to obtain an estimate of the time constant distribution underlying the observed transient. The method is based on an iterative deconvolution that produces an approximation to the time constant spectrum while preserving a convenient convolution form. This method is applied to the obtained thermal response of a microstructure as analyzed by finite element method as well as to the measured thermal response of a transistor array integrated circuit (IC) in a SMD package.ca_ES
dc.description.sponsorshipThis work was presented at the Fourth International Workshop on Thermal Investigations of IC’s and Microstuctures, Cannes, “Cˆote d’Azur,” France, September 27–29, 1998. This work was supported by Spanish CICYT TIC98-0987-C03-03.ca_ES
dc.identifier.doihttps://doi.org/10.1109/6144.774738
dc.identifier.idgrec003024
dc.identifier.issn1521-3331
dc.identifier.urihttp://hdl.handle.net/10459.1/57441
dc.language.isoengca_ES
dc.publisherInstitute of Electrical and Electronics Engineersca_ES
dc.relationinfo:eu-repo/grantAgreement/MIECU//TIC98-0987-C03-03/ES/ca_ES
dc.relation.isformatofReproducció del document publicat a https://doi.org/10.1109/6144.774738ca_ES
dc.relation.ispartofIEEE Transactions on Components and Packaging Technologies, 1999, vol. 22, núm. 2ca_ES
dc.rights(c) IEEE, 1999ca_ES
dc.rights.accessRightsinfo:eu-repo/semantics/restrictedAccessca_ES
dc.subjectCompact modelsca_ES
dc.subjectDeconvolutionca_ES
dc.subjectMETSca_ES
dc.titleA Time-Domain Method for the Analysis of Thermal Impedance Response Preserving the Convolution Formca_ES
dc.typearticleca_ES
dc.type.versionpublishedVersionca_ES
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