A Time-Domain Method for the Analysis of Thermal Impedance Response Preserving the Convolution Form
dc.contributor.author | Carmona, Manuel | |
dc.contributor.author | Marco, Santiago | |
dc.contributor.author | Palacín Roca, Jordi | |
dc.contributor.author | Samitier, Josep | |
dc.date.accessioned | 2016-07-12T08:50:42Z | |
dc.date.embargoEndDate | 2025-01-01 | |
dc.date.issued | 1999 | |
dc.description.abstract | The study of the thermal behavior of complex packages as multichip modules (MCM’s) is usually carried out by measuring the so-called thermal impedance response, that is: the transient temperature after a power step. From the analysis of this signal, the thermal frequency response can be estimated, and consequently, compact thermal models may be extracted. We present a method to obtain an estimate of the time constant distribution underlying the observed transient. The method is based on an iterative deconvolution that produces an approximation to the time constant spectrum while preserving a convenient convolution form. This method is applied to the obtained thermal response of a microstructure as analyzed by finite element method as well as to the measured thermal response of a transistor array integrated circuit (IC) in a SMD package. | ca_ES |
dc.description.sponsorship | This work was presented at the Fourth International Workshop on Thermal Investigations of IC’s and Microstuctures, Cannes, “Cˆote d’Azur,” France, September 27–29, 1998. This work was supported by Spanish CICYT TIC98-0987-C03-03. | ca_ES |
dc.identifier.doi | https://doi.org/10.1109/6144.774738 | |
dc.identifier.idgrec | 003024 | |
dc.identifier.issn | 1521-3331 | |
dc.identifier.uri | http://hdl.handle.net/10459.1/57441 | |
dc.language.iso | eng | ca_ES |
dc.publisher | Institute of Electrical and Electronics Engineers | ca_ES |
dc.relation | info:eu-repo/grantAgreement/MIECU//TIC98-0987-C03-03/ES/ | ca_ES |
dc.relation.isformatof | Reproducció del document publicat a https://doi.org/10.1109/6144.774738 | ca_ES |
dc.relation.ispartof | IEEE Transactions on Components and Packaging Technologies, 1999, vol. 22, núm. 2 | ca_ES |
dc.rights | (c) IEEE, 1999 | ca_ES |
dc.rights.accessRights | info:eu-repo/semantics/restrictedAccess | ca_ES |
dc.subject | Compact models | ca_ES |
dc.subject | Deconvolution | ca_ES |
dc.subject | METS | ca_ES |
dc.title | A Time-Domain Method for the Analysis of Thermal Impedance Response Preserving the Convolution Form | ca_ES |
dc.type | article | ca_ES |
dc.type.version | publishedVersion | ca_ES |
Files
License bundle
1 - 1 of 1
Loading...
- Name:
- license.txt
- Size:
- 1.71 KB
- Format:
- Item-specific license agreed upon to submission
- Description: