Numerical parametric study of a hotspot-targeted microfluidic cooling array for microelectronics
Fecha de publicación2018-11-05
Fréchette, L. G.
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Thermal management in integrated chips is one of the major challenges on micro- and nanoelectronics. The rise of power density raised the need for microchannel liquid cooling solutions. This technology has poor temperature uniformity and requires high pumping powers. In this work, a cooling scheme aiming for high temperature uniformity and low pumping power is numerically studied. The cooling scheme consists in a matrix of microfluidic cells with thermally activated microvalves, which tailor the local coolant flow rates to avoid overcooling and improve the temperature uniformity. This system is assessed with steady state CFD studies combined with temporal integration in a time dependent and non-uniform heat load scenario. The studied cooling scheme improves, with respect to existing devices for similar applications, the chip temperature uniformity while reducing the pumping power by 50%.
Es parte deApplied Thermal Engineering, 2018, vol. 144, p. 71-80
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