Stepwise varying width microchannel cooling device for uniform wall temperature: Experimental and numerical study

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2015Suggested citation
Riera Curt, Sara;
Barrau, Jérôme;
Omri, Mohamed;
Fréchette, L. G.;
Rosell Urrutia, Joan Ignasi;
.
(2015)
.
Stepwise varying width microchannel cooling device for uniform wall temperature: Experimental and numerical study.
Applied Thermal Engineering , 2015, vol. 78, p. 30-38.
https://doi.org/10.1016/j.applthermaleng.2014.12.012.
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Within the high heat extraction cooling technologies, stepwise varying width microchannel cooling
schemes have demonstrated their capacity to provide high temperature uniformities with low pressure
drops. In this study, a method to tailor the design of this kind of cooling device to the needs on an
application is developed. The resulting geometry is experimentally tested. A global thermal resistance
coefficient of 2.35$10 5 m2 K/W has been found, improving near three-fold the performance in a millimetrical
scale for the same flow rate. The temperature profile of the wall temperature is quite uniform,
validating the design of the cooling device. A numerical model is developed and validated through
comparison with experimental results. It shows the smoothing effect of the Thermal Interface Material
(TIM) on the temperature profile and the improvement of both the thermal resistance coefficient and the
temperature uniformity with the increase of the flow velocity.