Dynamic Compact Thermal Models With Multiple Power Sources: Application to an Ultrathin Chip Stacking Technology

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Date
2005
Authors
Palacín Roca, JordiPalacín Roca, Jordi - ORCID ID
Salleras, Marc
Samitier, Josep
Marco, Santiago
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http://hdl.handle.net/10459.1/57618
DOI
https://doi.org/10.1109/TADVP.2005.850507
Journal or Serie
IEEE Transaction on Advanced Packaging, 2005, vol. 28, p. 694-703
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Articles publicats (Enginyeria Industrial i de l’Edificació)
Grup de Recerca en Robòtica i Processament de Senyal (INSPIRES)