A Time-Domain Method for the Analysis of Thermal Impedance Response Preserving the Convolution Form
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Date
1999
Authors
Carmona, Manuel
Marco, Santiago
Palacín Roca, Jordi
Samitier, Josep
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Abstract
The study of the thermal behavior of complex
packages as multichip modules (MCM’s) is usually carried out
by measuring the so-called thermal impedance response, that
is: the transient temperature after a power step. From the
analysis of this signal, the thermal frequency response can be
estimated, and consequently, compact thermal models may be
extracted. We present a method to obtain an estimate of the
time constant distribution underlying the observed transient. The
method is based on an iterative deconvolution that produces an
approximation to the time constant spectrum while preserving
a convenient convolution form. This method is applied to the
obtained thermal response of a microstructure as analyzed by
finite element method as well as to the measured thermal response
of a transistor array integrated circuit (IC) in a SMD package.
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IEEE Transactions on Components and Packaging Technologies, 1999, vol. 22, núm. 2