effects on plastic properties. These interactions are a case study of environmental stress cracking, which is considered one of the most common causes of plastic failure. The aim of this work is an experimental study of interactions of some PCM typically used for thermal energy storage, and some plastic materials currently used as encapsulating materials. With the materials tested in this work, it can be concluded that, for encapsulating organic PCM, low-density polyethylene and polypropylene showed worse behaviour than high-density polyethylene.