Browsing Articles publicats (Informàtica i Enginyeria Industrial) by Author "Carmona, Manuel"

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A Time-Domain Method for the Analysis of Thermal Impedance Response Preserving the Convolution Form

Carmona, Manuel; Marco, Santiago; Palacín Roca, Jordi; Samitier, Josep (Institute of Electrical and Electronics Engineers, 1999)

The study of the thermal behavior of complex packages as multichip modules (MCM’s) is usually carried out by measuring the so-called thermal impedance response, that is: the transient temperature after a power step. ...
Comparison of three different devices available in Spain to test thermal properties of building materials including phase change materials

Barreneche Güerisoli, Camila; Gracia Cuesta, Alvaro de; Serrano, Susana; Navarro, Maria E.; Borreguero, Ana María; Fernández Renna, Ana Inés; Carmona, Manuel; Rodriguez, Juan Francisco; Cabeza, Luisa F. (Elsevier, 2013)

Thermal properties of materials used in building envelopes must be analysed in order to evaluate the thermal response of the constructive system. This thermal characterisation is a key point during the design phase of a ...